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Deesyn IC Test & Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins

Deesyn IC Test & Burn-in Socket for QFN Packages, QFN76, Open Top, 0.4mm Pitch, 76Pins, 9X9sqmm (Package Outline): Electronics. Buy Deesyn IC Test & Burn-in Socket for QFN Packages, QFN76, Open Top, 0.4mm Pitch, 76Pins, 9X9sqmm (Package Outline): Connectors & Adapters - ✓ FREE DELIVERY possible on eligible purchases. Open top style, buckling beam contacts, thru-Hole mount 。 Active alignment for IC package positioning 。 Centre Contact available for exposed pads, heat sink and floating base non sticking option 。 Accommodates 0.5 ~1.2mm thick package 。 X-shape stand-off prevents package from sticking 。

Deesyn IC Test & Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins

Deesyn IC Test /& Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins
Deesyn IC Test /& Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins
Deesyn IC Test /& Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins
Deesyn IC Test /& Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins
Deesyn IC Test /& Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins

Deesyn IC Test & Burn-in Socket for QFN Packages 9X9sqmm Open Top 0.4mm Pitch Package Outline QFN76 76Pins

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